16 results
Strain Measurements from Single Grains in Passivated Aluminum Conductor Lines by X-Ray Microdiffraction During Electromigration
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- Journal:
- MRS Online Proceedings Library Archive / Volume 612 / 2000
- Published online by Cambridge University Press:
- 17 March 2011, D8.6.1
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- 2000
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Microtexture and Strain in Electroplated Copper Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 612 / 2000
- Published online by Cambridge University Press:
- 17 March 2011, D10.3.1
- Print publication:
- 2000
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Grain Orientation and Strain Measurements in Sub-Micron wide Passivated Individual Aluminum Test Structures
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- Journal:
- MRS Online Proceedings Library Archive / Volume 612 / 2000
- Published online by Cambridge University Press:
- 17 March 2011, D8.8.1
- Print publication:
- 2000
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Electromigration Voiding in Argon-Implanted Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 563 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 97
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- 1999
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Effect of Modified Metal/Passivation Interfaces on Stress Voiding in Interconnects+
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- Journal:
- MRS Online Proceedings Library Archive / Volume 563 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 219
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- 1999
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Kinetics of the Tial3 Formation From Al/Ti Thin Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 563 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 27
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- 1999
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Interfacial reactions in multilayers intended for microelectronics devices
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- Journal:
- MRS Online Proceedings Library Archive / Volume 514 / 1998
- Published online by Cambridge University Press:
- 10 February 2011, 547
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- 1998
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The Stress Change in Passivated Al Lines Due to the Reaction Between Ti and Al
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- Journal:
- MRS Online Proceedings Library Archive / Volume 516 / January 1998
- Published online by Cambridge University Press:
- 10 February 2011, 213
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- January 1998
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A High Voltage Scanning Electron Microscope for the In-SituObservation and Recording of Electromigration Voids in Metal Lines on Integrated Circuits.
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- Journal:
- Microscopy and Microanalysis / Volume 3 / Issue S2 / August 1997
- Published online by Cambridge University Press:
- 02 July 2020, pp. 615-616
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- August 1997
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Nucleation and Growth at Reactive Interfaces Followed by Impedance Measurements
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- Journal:
- MRS Online Proceedings Library Archive / Volume 500 / 1997
- Published online by Cambridge University Press:
- 10 February 2011, 125
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- 1997
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Strain Measurement and Calculation in Passivated Cu Lines Deposited by Three Different Methods
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- Journal:
- MRS Online Proceedings Library Archive / Volume 403 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 639
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- 1995
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Effectiveness and Reliability of Metal Diffusion Barriers for Copper Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 403 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 501
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- 1995
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Analysis of the Mechanical Failure in a Multilayered Thin Film System Tested by Microtensile Loading
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- MRS Online Proceedings Library Archive / Volume 391 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 85
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- 1995
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In Situ Observations of Voiding in Metal Lines Under Passivation
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- MRS Online Proceedings Library Archive / Volume 338 / 1994
- Published online by Cambridge University Press:
- 22 February 2011, 409
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- 1994
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High-Temperature Deformation of Nb-18 Al
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- Journal:
- MRS Online Proceedings Library Archive / Volume 213 / 1990
- Published online by Cambridge University Press:
- 26 February 2011, 329
- Print publication:
- 1990
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Thermal Oxidation of Al2O3-SiC Whisker Composites: Mechanisms and Kinetics
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- Journal:
- MRS Online Proceedings Library Archive / Volume 120 / 1988
- Published online by Cambridge University Press:
- 22 February 2011, 323
- Print publication:
- 1988
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